Product Details

BRAND: OTHER >> MODEL: B-727 >> PART NUMBER: PG10MMX4MMX10000X1UPX3.0IN
B-727

PG 10MMX4MMX10000PCS/ROLL 1UP 3.0INCH CORE GAP WITH PERFORATION HIGH TEMP POLYIMIDE GLOSSY WHITE, TOP BOTTOM WITH GAP 3MM SIDE GAP EDGE=3MM, WEB WIDTH 16MM

  • Category: LABEL
  • Brand: OTHER
  • Model: B-727
  • Part No: PG10MMX4MMX10000X1UPX3.0IN
  • Barcode: PG10MMX4MMX10000X1UPX3.0IN
  • Type: CONSUMMABLE
  • Description: PG 10MMX4MMX10000PCS/ROLL 1UP 3.0INCH CORE GAP WITH PERFORATION HIGH TEMP POLYIMIDE GLOSSY WHITE, TOP BOTTOM WITH GAP 3MM SIDE GAP EDGE=3MM, WEB WIDTH 16MM
Order No: 52500935

Product Overview

INTRODUCTION

BRADY B-727 GLOSSY WHITE THERMAL TRANSER PRINTABLE POLYIMIDE LABEL STOCK
TDS No. B-727


FEATURE

Print Technology: Thermal transfer
Material Type: White polyimide (2 mil film)
Finish: Glossy
Adhesive: Permanent Acrylic

Introduction

1mil Gloss White PI TC/S8088/BG50
MZ2001 is durable gloss white top coated high temperature resistant polyimide label material with high performance acrylic solvent based permanent adhesive
specifically designed for high ultimate adhesion, excellent resistance to PCB
processing chemicals and withstanding high temperatures for extended periods of time, featuring excellent tear strength, heat resistance, dimensional stability and chemical resistance.

Feature
TYPICAL PERFORMANCE DATA (N/25mm)
Loop Tack -FTM 9: ↑12N/in
Peel Adhes. 90o-FTM 2 : ↑ 9N/in
Minimum Application Temperature: 10°C
Service Temperature Range: -40°C~+250°C
Surface conditions
The top coating on this product provides superior imprinting characteristics and
smudge resistance. Testing is recommended to ensure satisfactory toner anchorage and print results with specific printer and ribbon combination.

Application and Uses
This product is ideal for labeling printed circuit boards as well as for automotive, aerospace, medical, and manufacturing applications where high temperature and solvent resistance are critical. It is able to withstand surface mount circuit board processes on either the top or bottom side of the board. This product can also be used on the top side of the board in mixed processes and suitable for use on the bottom side when directly exposed to wave solder environment.


BROCHURE


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